High-performance PO film for semiconductor and display processes. Produced in our own Taiwan factory with a proprietary formula, covering dicing, expanding, cutting and glass alkali etching / thinning. Delivering top quality and industry-leading cost performance.
Fully integrated production in our own Taiwan factory. We manage quality in-house from base film to shipment, ensuring stable properties and short lead times.
An original formulation built on years of expertise. We tune adhesion, elongation and cutting suitability per application, meeting demands that generic films cannot.
While keeping quality high, our price-to-performance balance is industry-leading — contributing to lower total cost in mass production.
Representative properties of all nine ANET-P8 models. MD = machine direction, TD = transverse direction. Each cell reads "test range / typical value".
| No. | Model | Thk. μm | Ultimate tensile MPa | Modulus MPa | Elongation % | Application | |||
|---|---|---|---|---|---|---|---|---|---|
| Test range | Typical | Test range | Typical | Test range | Typical | ||||
| 1 | ANET-P8020 | 88 / 147 | MD ≥25 TD ≥25 | 32 29 |
MD 100–150 TD 100–150 | 134 136 |
MD ≥650 TD ≥650 | 731 788 |
Laser cut OK · rotary blade not OKExpandable |
| 2 | ANET-P80201 | 50 / 80 / 88 / 100 / 147 / 150 | MD ≥20 TD ≥15 | 23 21 |
MD 80–130 TD 80–130 | 110 112 |
MD ≥700 TD ≥700 | 880 910 |
ExpandableCuttable |
| 3 | ANET-P80202 | 88 / 147 | MD ≥30 TD ≥25 | 32 29 |
MD 100–150 TD 100–150 | 135 136 |
MD ≥650 TD ≥650 | 735 785 |
CuttableNot expandable |
| 4 | ANET-P8023 | 142 | MD ≥20 TD ≥20 | 23 22 |
MD 130–180 TD 130–180 | 167 159 |
MD ≥750 TD ≥750 | 950 987 |
CuttableNot expandable |
| 5 | ANET-P80208 | 90 / 150 | MD ≥25 TD ≥25 | 32 29 |
MD 180–230 TD 180–230 | 212 209 |
MD ≥750 TD ≥750 | 912 873 |
ExpandableCuttable |
| 6 | ANET-P80209 | 80 / 150 | MD ≥25 TD ≥20 | 29 23 |
MD 160–200 TD 160–200 | 183 191 |
MD ≥750 TD ≥750 | 839 997 |
ExpandableCuttable |
| 7 | ANET-P80221 | 80 / 200 | MD ≥20 TD ≥15 | 24 21 |
MD 100–140 TD 100–140 | 109 116 |
MD ≥800 TD ≥800 | 1069 1092 |
ExpandableCuttable Improved ANET-P80201 & ANET-P80209 |
| 8 | ANET-P80211 | 100 / 145 / 150 | MD ≥25 TD ≥20 | 32 32 |
MD 380–430 TD 380–430 | 415 407 |
MD ≥800 TD ≥800 | 970 991 |
Glass alkali etching / thinning |
| 9 | ANET-P80212 | 150 | MD ≥20 TD ≥15 | 25 20 |
MD 180–230 TD 180–230 | 209 201 |
MD ≥800 TD ≥800 | 1091 1070 |
Improved · cutting (no adhesive residue) |
※ Values are representative, not guaranteed. Some typical values include reference figures estimated from adjacent models. Please confirm official values in the datasheet.
※ MD = Machine Direction, TD = Transverse Direction. Contact us for detailed specifications and datasheets.
Dicing and cutting of wafers and substrates. Choose from laser-cut compatible grades to improved low-residue types by application.
Elongation suited to expand processes that widen chip spacing. High-elongation models such as ANET-P80221 available.
High-modulus type (ANET-P80211) for glass alkali etching / thinning. Protection under chemical environments.
Surface protection for displays and electronic parts. We propose the optimal grade from a broad 50–200 μm line-up.
We support model selection to match your application and process, provide datasheets, and arrange free samples.
